Evonik unveils new wafer-cutting solutions

Evonik has launched new wetting agents and defoamers for PV wafer-cutting equipment, specifically designed for high-speed diamond and multi-wire sawing processes. These products aim to improve wafer cutting quality, increase cutting speeds, reduce dosing rates, and enhance system optimization. The launch took place at the recent SNEC PV Power Expo in Shanghai, China.

Source:

https://www.pv-magazine.com/2023/06/02/evonik-unveils-new-wafer-cutting-solutions/

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